Enhanced Temperature Control Method Using ANFIS with FPGA

Temperature control in etching process is important for semiconductor manufacturing technology. However, pressure variations in vacuum chamber results in a change in temperature, worsening the accuracy of the temperature of the wafer and the speed and quality of the etching process. This work develo...

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Veröffentlicht in:TheScientificWorld Jg. 2014; H. 2014; S. 1 - 8
Hauptverfasser: Chang, Cheng-Yuan, Zhou, Jun-Tin, Pan, Shing-Tai, Huang, Chiung-Wei
Format: Journal Article
Sprache:Englisch
Veröffentlicht: Cairo, Egypt Hindawi Publishing Corporation 01.01.2014
John Wiley & Sons, Inc
Wiley
Schlagworte:
Algorithms
Computer engineering
Computers
Digital integrated circuits
Electronics industry
Equipment and supplies
Experiments
Fuzzy algorithms
Fuzzy Logic
Fuzzy systems
Mathematical models
Methods
Models, Theoretical
Plasma etching
R&D
Research & development
Temperature
Temperature control
ISSN:2356-6140, 1537-744X, 1537-744X
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Zusammenfassung:Temperature control in etching process is important for semiconductor manufacturing technology. However, pressure variations in vacuum chamber results in a change in temperature, worsening the accuracy of the temperature of the wafer and the speed and quality of the etching process. This work develops an adaptive network-based fuzzy inference system (ANFIS) using a field-programmable gate array (FPGA) to improve the effectiveness. The proposed method adjusts every membership function to keep the temperature in the chamber stable. The improvement of the proposed algorithm is confirmed using a medium vacuum (MV) inductively-coupled plasma- (ICP-) type etcher.
Bibliographie:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
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Academic Editors: G. Litak, F. Liu, and B. Yasilata
ISSN:2356-6140
1537-744X
1537-744X
DOI:10.1155/2014/239261