Oxygen-Dependent Instability and Annealing/Passivation Effects in Amorphous In-Ga-Zn-O Thin-Film Transistors

This letter discusses the reason for the instability of amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) under both positive and negative bias stresses. This instability is significantly influenced by the oxygen content in the bulk IGZO and the surrounding environment. The a...

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Bibliographic Details
Published in:IEEE electron device letters Vol. 32; no. 11; pp. 1552 - 1554
Main Authors: Chen, Wei-Tsung, Lo, Shih-Yi, Kao, Shih-Chin, Zan, Hsiao-Wen, Tsai, Chuang-Chuang, Lin, Jian-Hong, Fang, Chun-Hsiang, Lee, Chung-Chun
Format: Journal Article
Language:English
Published: New York, NY IEEE 01.11.2011
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN:0741-3106, 1558-0563
Online Access:Get full text
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Summary:This letter discusses the reason for the instability of amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) under both positive and negative bias stresses. This instability is significantly influenced by the oxygen content in the bulk IGZO and the surrounding environment. The as-fabricated low-temperature devices can only endure a single polarized bias stress. An a-IGZO TFT that is stable toward both positive and negative bias stresses with large relaxation times of 95 × 10 4 and 371 × 10 4 s, respectively, is achieved by annealing and passivation.
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ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2011.2165694