The process capability of HAL

The Hot Air Leveling Users Group (HUG) is a non-profit organization comprised of PCB manufacturers, designers, assemblers, chemical and equipment suppliers whose charter is to understand the complexities of the hot air leveling (HAL) manufacturing process as it relates to the contract assembler. A t...

Celý popis

Uloženo v:
Podrobná bibliografie
Vydáno v:Printed Circuit Fabrication Ročník 22; číslo 5; s. 42
Hlavní autor: Fellman, Jack
Médium: Trade Publication Article
Jazyk:angličtina
Vydáno: San Francisco Printed Circuit Engineering Association, Inc 01.05.1999
Témata:
Design of experiments
Manufacturers
Manufacturing
Nonprofit organizations
Printed circuit boards
Standard deviation
United States > US
ISSN:0274-8096
On-line přístup:Získat plný text
Tagy: Přidat tag
Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!
Popis
Shrnutí:The Hot Air Leveling Users Group (HUG) is a non-profit organization comprised of PCB manufacturers, designers, assemblers, chemical and equipment suppliers whose charter is to understand the complexities of the hot air leveling (HAL) manufacturing process as it relates to the contract assembler. A test vehicle was designed by the HUG team and manufactured by member companies. A preliminary report on data from one HAL process is presented.
ISSN:0274-8096