The process capability of HAL

The Hot Air Leveling Users Group (HUG) is a non-profit organization comprised of PCB manufacturers, designers, assemblers, chemical and equipment suppliers whose charter is to understand the complexities of the hot air leveling (HAL) manufacturing process as it relates to the contract assembler. A t...

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Vydané v:Printed Circuit Fabrication Ročník 22; číslo 5; s. 42
Hlavný autor: Fellman, Jack
Médium: Trade Publication Article
Jazyk:English
Vydavateľské údaje: San Francisco Printed Circuit Engineering Association, Inc 01.05.1999
Predmet:
Design of experiments
Manufacturers
Manufacturing
Nonprofit organizations
Printed circuit boards
Standard deviation
United States > US
ISSN:0274-8096
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Popis
Shrnutí:The Hot Air Leveling Users Group (HUG) is a non-profit organization comprised of PCB manufacturers, designers, assemblers, chemical and equipment suppliers whose charter is to understand the complexities of the hot air leveling (HAL) manufacturing process as it relates to the contract assembler. A test vehicle was designed by the HUG team and manufactured by member companies. A preliminary report on data from one HAL process is presented.
ISSN:0274-8096