HUG meeting

The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was ma...

Full description

Saved in:
Bibliographic Details
Published in:Printed Circuit Fabrication Vol. 22; no. 11; p. 104
Main Author: Fellman, Jack
Format: Journal Article Trade Publication Article
Language:English
Published: San Francisco Printed Circuit Engineering Association, Inc 01.11.1999
Subjects:
Alloys
Conferences
Interconnect
Printed circuit boards
R&D
Research & development
Trends
United States > US
ISSN:0274-8096
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was made. A hot air leveling defect guide was distributed for comments by members. Also held was a thorough discussion of suggestions for Phase III testing.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0274-8096