HUG meeting

The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was ma...

Celý popis

Uloženo v:
Podrobná bibliografie
Vydáno v:Printed Circuit Fabrication Ročník 22; číslo 11; s. 104
Hlavní autor: Fellman, Jack
Médium: Journal Article Trade Publication Article
Jazyk:angličtina
Vydáno: San Francisco Printed Circuit Engineering Association, Inc 01.11.1999
Témata:
Alloys
Conferences
Interconnect
Printed circuit boards
R&D
Research & development
Trends
United States > US
ISSN:0274-8096
On-line přístup:Získat plný text
Tagy: Přidat tag
Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!
Popis
Shrnutí:The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was made. A hot air leveling defect guide was distributed for comments by members. Also held was a thorough discussion of suggestions for Phase III testing.
Bibliografie:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0274-8096