HUG meeting

The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was ma...

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Bibliographic Details

Published in:	Printed Circuit Fabrication Vol. 22; no. 11; p. 104
Main Author:	Fellman, Jack
Format:	Journal Article Trade Publication Article
Language:	English
Published:	San Francisco Printed Circuit Engineering Association, Inc 01.11.1999
Subjects:	Alloys Conferences Interconnect Printed circuit boards R&D Research & development Trends United States > US
ISSN:	0274-8096
Online Access:	Get full text
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