HUG meeting

The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was ma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Printed Circuit Fabrication Jg. 22; H. 11; S. 104
1. Verfasser:	Fellman, Jack
Format:	Journal Article Trade Publication Article
Sprache:	Englisch
Veröffentlicht:	San Francisco Printed Circuit Engineering Association, Inc 01.11.1999
Schlagworte:	Alloys Conferences Interconnect Printed circuit boards R&D Research & development Trends United States > US
ISSN:	0274-8096
Online-Zugang:	Volltext
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