Active thermal loading control of the modular multilevel converter by a multi-objective optimization method

The modular multilevel converter (MMC) has become the most attractive converter topology for medium/high-power applications. However, uneven power loss distribution and thermal loading among the semiconductor devices of each submodule (SM) compromise the reliability and lifetime of the converter. In...

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Bibliographic Details
Published in:IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society pp. 4482 - 4487
Main Authors: Qichen Yang, Saeedifard, Maryam
Format: Conference Proceeding
Language:English
Published: IEEE 01.10.2017
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Online Access:Get full text
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