Active thermal loading control of the modular multilevel converter by a multi-objective optimization method
The modular multilevel converter (MMC) has become the most attractive converter topology for medium/high-power applications. However, uneven power loss distribution and thermal loading among the semiconductor devices of each submodule (SM) compromise the reliability and lifetime of the converter. In...
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| Published in: | IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society pp. 4482 - 4487 |
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| Main Authors: | , |
| Format: | Conference Proceeding |
| Language: | English |
| Published: |
IEEE
01.10.2017
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| Subjects: | |
| Online Access: | Get full text |
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