NodeRank: Observation-Point Insertion for Fault Localization in Monolithic 3D ICs

Monolithic 3D (M3D) ICs have emerged as a promising technology with significant improvement in power, performance, and area (PPA) over conventional 3D-stacked ICs. However, the sequential assembly of M3D tiers and immature fabrication process are prone to manufacturing defects and intertier process...

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Vydané v:Proceedings - Asian Test Symposium s. 1 - 6
Hlavní autori: Chaudhuri, Arjun, Banerjee, Sanmitra, Chakrabarty, Krishnendu
Médium: Konferenčný príspevok..
Jazyk:English
Vydavateľské údaje: IEEE 23.11.2020
Predmet:
Circuit faults
Fabrication
Logic gates
Measurement
monolithic 3D
Observability
observation-point insertion
Three-dimensional displays
ISSN:2377-5386
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Shrnutí:Monolithic 3D (M3D) ICs have emerged as a promising technology with significant improvement in power, performance, and area (PPA) over conventional 3D-stacked ICs. However, the sequential assembly of M3D tiers and immature fabrication process are prone to manufacturing defects and intertier process variations. Tier-level fault localization is therefore essential for yield ramp-up and diagnosis. Due to overhead concerns, only a limited number of observation points (OPs) can be inserted on the outgoing inter-layer vias (ILVs) of a tier to enable fault localization. We propose the computationally efficient NodeRank algorithm for observation-point insertion (OPI) on a small subset of outgoing ILVs. An ATPG-independent heuristic is presented, which is several orders-of-magnitude faster than ATPG fault simulation-based OPI. We introduce a metric called degree of fault localization to quantify the effectiveness of OPs. Evaluation results for two-tier M3D benchmark circuits show the effectiveness of the proposed method.
ISSN:2377-5386
DOI:10.1109/ATS49688.2020.9301589