Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique

A chip to package interaction risk assessment platform has been developed using finite element analysis, meta-modeling and genetic algorithm optimization method to tackle increasing variations in package specifications. The results show that the meta-model can efficiently predict BEOL peeling stress...

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Veröffentlicht in:	IEEE International Reliability Physics Symposium proceedings S. 1 - 6
Hauptverfasser:	Lee, Moon Soo, Baick, Inhak, Kim, Min, Kwon, Seo Hyun, Yeo, Myeong Soo, Rhee, Hwasung, Lee, Euncheol
Format:	Tagungsbericht
Sprache:	Englisch
Veröffentlicht:	IEEE 01.03.2021
Schlagworte:	Chip packaging interaction Finite element modeling Meta-modeling Metamodeling Multi-objective optimization Reliability Risk management Semiconductor device modeling Stress Tensile stress Ultralow-k dielectric
ISSN:	1938-1891
Online-Zugang:	Volltext
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