Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique

A chip to package interaction risk assessment platform has been developed using finite element analysis, meta-modeling and genetic algorithm optimization method to tackle increasing variations in package specifications. The results show that the meta-model can efficiently predict BEOL peeling stress...

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Vydané v:IEEE International Reliability Physics Symposium proceedings s. 1 - 6
Hlavní autori: Lee, Moon Soo, Baick, Inhak, Kim, Min, Kwon, Seo Hyun, Yeo, Myeong Soo, Rhee, Hwasung, Lee, Euncheol
Médium: Konferenčný príspevok..
Jazyk:English
Vydavateľské údaje: IEEE 01.03.2021
Predmet:
Chip packaging interaction
Finite element modeling
Meta-modeling
Metamodeling
Multi-objective optimization
Reliability
Risk management
Semiconductor device modeling
Stress
Tensile stress
Ultralow-k dielectric
ISSN:1938-1891
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Popis
Shrnutí:A chip to package interaction risk assessment platform has been developed using finite element analysis, meta-modeling and genetic algorithm optimization method to tackle increasing variations in package specifications. The results show that the meta-model can efficiently predict BEOL peeling stress and solder von Mises stress of FCBGA device at reflow condition with eleven design variables. Baselines for two critical stresses are determined from qualification and mass production experiences. Room for stress mitigation is also investigated.
ISSN:1938-1891
DOI:10.1109/IRPS46558.2021.9405133