Applications of Broyden-based Input Space Mapping to Modeling and Design Optimization in High-Tech Companies in Mexico

One of the most powerful and computationally efficient optimization approaches in RF and microwave engineering is the space mapping (SM) approach to design. SM optimization methods belong to the general class of surrogate-based optimization algorithms. They are specialized on the efficient optimizat...

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Veröffentlicht in:2019 49th European Microwave Conference (EuMC) S. 272 - 275
Hauptverfasser: Rayas-Sanchez, Jose E., Brito-Brito, Zabdiel
Format: Tagungsbericht
Sprache:Englisch
Veröffentlicht: European Microwave Association (EuMA) 01.10.2019
Schlagworte:
Broyden
Computational modeling
Design optimization
DoE
equalization
eye diagram
highspeed interconnects
Jacobian matrices
Microwave theory and techniques
optimization
Parameter extraction
post-silicon validation
power integrity
signal integrity
space mapping
surrogate models
Tuning
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Zusammenfassung:One of the most powerful and computationally efficient optimization approaches in RF and microwave engineering is the space mapping (SM) approach to design. SM optimization methods belong to the general class of surrogate-based optimization algorithms. They are specialized on the efficient optimization of computationally expensive models. This paper reviews the Broyden-based input SM algorithm, better known as aggressive space mapping (ASM), which is perhaps the SM variation with more industrial applications. The two main characteristics that explain its popularity in industry and academia are emphasized in this paper: simplicity and efficiency. The fundamentals behind the Broyden-based input SM algorithm are described, highlighting key steps for its successful implementation, as well as situations where it may fail. Recent applications of the Broyden-based input space mapping algorithm in high-tech industries located in Mexico are briefly described, including application areas such as signal integrity and highspeed interconnect design, as well as post-silicon validation of high-performance computer platforms, among others. Emerging new applications in multi-physics interconnect design and power-integrity design optimization are also mentioned.
DOI:10.23919/EuMC.2019.8910799