3D modeling based on current continuity for STM carrier profiling of semiconductor devices

Current continuity based 3D modeling of STM carrier profiling of semiconductor devices is achieved for the first time. Tunnel currents between probe tip and devices are solved consistently with current continuity consideration. It is revealed that tunnel current is reduced in current continuity mode...

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Veröffentlicht in:2011 International Conference on Simulation of Semiconductor Processes and Devices S. 259 - 262
Hauptverfasser: Fukuda, K., Nishizawa, M., Tada, T., Bolotov, L., Suzuki, K., Sato, S., Arimoto, H., Kanayama, T.
Format: Tagungsbericht
Sprache:Englisch
Japanisch
Veröffentlicht: IEEE 01.09.2011
Schlagworte:
Electric potential
Junctions
Probes
Semiconductor device measurement
Semiconductor process modeling
Three dimensional displays
Tunneling
ISBN:9781612844190, 1612844197
ISSN:1946-1569
Online-Zugang:Volltext
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Beschreibung
Zusammenfassung:Current continuity based 3D modeling of STM carrier profiling of semiconductor devices is achieved for the first time. Tunnel currents between probe tip and devices are solved consistently with current continuity consideration. It is revealed that tunnel current is reduced in current continuity model under depletion conditions. Spatial resolution achieved in the model is discussed in comparison to potential based modeling. Influence of discrete dopants is also discussed in concern with Coulomb potential fluctuations in nanoscale systems, which is a key issue of nano devices.
ISBN:9781612844190
1612844197
ISSN:1946-1569
DOI:10.1109/SISPAD.2011.6035074