Combined Split Manufacturing and Logic Obfuscation Based on Emerging Technologies at High Level for Secure 3D IC Design

Split Manufacturing (SM) and Logic Obfuscation (LO) are potent design-for-trust solutions to mitigate hardware security threats when fabricating Integrated Circuits (ICs) at untrusted foundries. However, many such defense methods are subject to attacks such as Network Flow Attack and Boolean Satisfi...

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Veröffentlicht in:	Conference proceedings : Midwest Symposium on Circuits and Systems S. 1403 - 1407
Hauptverfasser:	Chakraborty, Haimanti, Vemuri, Ranga
Format:	Tagungsbericht
Sprache:	Englisch
Veröffentlicht:	IEEE 11.08.2024
Schlagworte:	3D Integrated Circuits Circuits and systems Emerging Technologies (Polymorphic Switch Boxes) Foundries Hardware security Hardware Security at High Level Logic Logic Obfuscation Manufacturing Split Manufacturing Switches Three-dimensional displays
ISSN:	1558-3899
Online-Zugang:	Volltext
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