APA (7th ed.) Citation

Chakraborty, H., & Vemuri, R. (2024, August 11). Combined Split Manufacturing and Logic Obfuscation Based on Emerging Technologies at High Level for Secure 3D IC Design. Conference proceedings : Midwest Symposium on Circuits and Systems, 1403-1407. https://doi.org/10.1109/MWSCAS60917.2024.10658909

Chicago Style (17th ed.) Citation

Chakraborty, Haimanti, and Ranga Vemuri. "Combined Split Manufacturing and Logic Obfuscation Based on Emerging Technologies at High Level for Secure 3D IC Design." Conference Proceedings : Midwest Symposium on Circuits and Systems 11 Aug. 2024: 1403-1407. https://doi.org/10.1109/MWSCAS60917.2024.10658909.

MLA (9th ed.) Citation

Chakraborty, Haimanti, and Ranga Vemuri. "Combined Split Manufacturing and Logic Obfuscation Based on Emerging Technologies at High Level for Secure 3D IC Design." Conference Proceedings : Midwest Symposium on Circuits and Systems, 11 Aug. 2024, pp. 1403-1407, https://doi.org/10.1109/MWSCAS60917.2024.10658909.