Chakraborty, H., & Vemuri, R. (2024, August 11). Combined Split Manufacturing and Logic Obfuscation Based on Emerging Technologies at High Level for Secure 3D IC Design. Conference proceedings : Midwest Symposium on Circuits and Systems, 1403-1407. https://doi.org/10.1109/MWSCAS60917.2024.10658909
Citace podle Chicago (17th ed.)Chakraborty, Haimanti, a Ranga Vemuri. "Combined Split Manufacturing and Logic Obfuscation Based on Emerging Technologies at High Level for Secure 3D IC Design." Conference Proceedings : Midwest Symposium on Circuits and Systems 11 Aug. 2024: 1403-1407. https://doi.org/10.1109/MWSCAS60917.2024.10658909.
Citace podle MLA (9th ed.)Chakraborty, Haimanti, a Ranga Vemuri. "Combined Split Manufacturing and Logic Obfuscation Based on Emerging Technologies at High Level for Secure 3D IC Design." Conference Proceedings : Midwest Symposium on Circuits and Systems, 11 Aug. 2024, pp. 1403-1407, https://doi.org/10.1109/MWSCAS60917.2024.10658909.