Optimization of interconnects for signal integrity using self - adaptation in real - parameter genetic algorithms with simulated binary cross over (SBX)

Signal integrity is the ability of a signal to generate correct responses in the circuit. High speed interconnect is the one in which the time taken by the propagating signal to travel between its end points cannot be neglected. High Speed Interconnects are modeled as Planar Transmission Line Struct...

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Bibliographic Details
Published in:2008 10th International Conference on Electromagnetic Interference & Compatibility : 26-27 November 2008 pp. 123 - 129
Main Authors: Sabanayagam, A., Kumar, V.A., Raju, S., Kumar, N.S.
Format: Conference Proceeding
Language:English
Published: IEEE 01.11.2008
Subjects:
Circuit simulation
Coupled Microstripline
Coupling Capacitance and Genetic Algorithm with SBX
Crosstalk
Frequency
Genetic algorithms
Integrated circuit interconnections
Mutual Inductance
Planar transmission lines
Printed circuits
Propagation delay
Signal design
Signal generators
Very large scale integration
ISBN:8190357514, 9788190357517
Online Access:Get full text
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Summary:Signal integrity is the ability of a signal to generate correct responses in the circuit. High speed interconnect is the one in which the time taken by the propagating signal to travel between its end points cannot be neglected. High Speed Interconnects are modeled as Planar Transmission Line Structures. Analysis and design of interconnections in high-speed VLSI chips and printed circuit boards are gaining importance because of the rapid increase in operating frequencies and decrease in feature sizes. Improperly designed interconnects can result in increased crosstalk, signal delay, ringing, inadvertent and false switching. In order to reduce adverse signal integrity effects it is necessary for the interconnects to have accurate physical dimensions which as a result reduces unwanted coupling between neighboring conductors of the interconnects. In this paper, Genetic algorithm based approach with SBX to find optimal solution for physical dimensions of High speed interconnects, in the form of coupled micro strip line is presented.
ISBN:8190357514
9788190357517