CARACTERIZAÇÃO FÍSICO-QUÍMICA DE PLACAS DE CIRCUITO IMPRESSO DE APARELHOS DE TELEFONE CELULAR

Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic w...

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Vydané v:Tecnologia em Metalurgia Materiais e Mineração Ročník 10; číslo 3; s. 231 - 238
Hlavní autori: Sant ana, Hellington Bastos da Silva de, Moura, Francisco José, Veit, Hugo Marcelo
Médium: Journal Article
Jazyk:Portuguese
Vydavateľské údaje: Sao Paulo Associação Brasileira de Metalurgia, Materiais e Mineração 01.07.2013
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ISSN:2176-1515, 2176-1515, 2176-1523
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Shrnutí:Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (<2001; >2002) and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards.
Bibliografia:ObjectType-Article-1
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ISSN:2176-1515
2176-1515
2176-1523
DOI:10.4322/tmm.2013.033