Combined scheduling algorithm for re-entrant batch-processing machines in semiconductor wafer manufacturing

In this paper, a new combined scheduling algorithm is proposed to address the problem of minimising total weighted tardiness on re-entrant batch-processing machines (RBPMs) with incompatible job families in the semiconductor wafer fabrication system (SWFS). The general combined scheduling algorithm...

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Bibliographic Details
Published in:International journal of production research Vol. 53; no. 6; pp. 1866 - 1879
Main Authors: Jia, Wenyou, Jiang, Zhibin, Li, You
Format: Journal Article
Language:English
Published: London Taylor & Francis 19.03.2015
Taylor & Francis LLC
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ISSN:0020-7543, 1366-588X
Online Access:Get full text
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Summary:In this paper, a new combined scheduling algorithm is proposed to address the problem of minimising total weighted tardiness on re-entrant batch-processing machines (RBPMs) with incompatible job families in the semiconductor wafer fabrication system (SWFS). The general combined scheduling algorithm forms batches according to parameters from the real-time scheduling simulation platform (ReS 2 ), and then sequences batches through slack-based mixed integer linear programming model (S-MILP), which is defined as batch-oriented combined scheduling algorithm. The new combined scheduling algorithm obtains families' parameters from ReS 2 and then sequences these families through modified S-MILP, which is defined as family-oriented combined scheduling algorithm. With rolling horizon control strategy, two combined scheduling algorithms can update RBPMs scheduling continually. The experiments are implemented on ReS 2 of SWFS and ILOG CPLEX, respectively. The results demonstrate the effectiveness of our proposed methods.
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ISSN:0020-7543
1366-588X
DOI:10.1080/00207543.2014.965355