3D reconstruction and defect pattern recognition of bonding wire based on stereo vision

Non‐destructive detection of wire bonding defects in integrated circuits (IC) is critical for ensuring product quality after packaging. Image‐processing‐based methods do not provide a detailed evaluation of the three‐dimensional defects of the bonding wire. Therefore, a method of 3D reconstruction a...

Celý popis

Uložené v:

Podrobná bibliografia
Vydané v:	CAAI Transactions on Intelligence Technology Ročník 9; číslo 2; s. 348 - 364
Hlavní autori:	Yu, Naigong, Li, Hongzheng, Xu, Qiao, Sie, Ouattara, Firdaous, Essaf
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	Beijing John Wiley & Sons, Inc 01.04.2024 Wiley
Predmet:	Aircraft Bonding bonding wire Deep learning defect detection Defects Electronic components Feature extraction Image quality Image reconstruction Image segmentation Integrated circuits Manufacturing Methods Pattern recognition point cloud point cloud segmentation Semiconductors Three dimensional models Vision systems Wire
ISSN:	2468-2322, 2468-6557, 2468-2322
On-line prístup:	Získať plný text
Tagy:	Pridať tag Žiadne tagy, Buďte prvý, kto otaguje tento záznam!

Buďte prvý, kto okomentuje tento záznam!