Comparison of thermal performances of plate-fin and pin-fin heat sinks subject to an impinging flow

In this paper, we compare thermal performances of two types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, experimental investigations are per...

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Vydáno v:International journal of heat and mass transfer Ročník 52; číslo 15; s. 3510 - 3517
Hlavní autoři: Kim, Dong-Kwon, Kim, Sung Jin, Bae, Jin-Kwon
Médium: Journal Article
Jazyk:angličtina
Vydáno: Kidlington Elsevier Ltd 01.07.2009
Elsevier
Témata:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Heat sink
Impinging flow
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Thermal resistance
Thermal resistance
Impinging flow
Heat sink
Air flow
Pressure drop
Electronic component
Plate heat exchanger
Interaction
Cooling system
Experimental study
Modeling
Finned surface
Heat transfer
ISSN:0017-9310, 1879-2189
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Shrnutí:In this paper, we compare thermal performances of two types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, experimental investigations are performed for various flow rates and channel widths. From experimental data, we suggest a model based on the volume averaging approach for predicting the pressure drop and the thermal resistance. By using the model, thermal resistances of the optimized plate-fin and pin-fin heat sinks are compared. Finally, a contour map, which depicts the ratio of the thermal resistances of the optimized plate-fin and pin-fin heat sinks as a function of dimensionless pumping power and dimensionless length, is presented. The contour map indicates that optimized pin-fin heat sinks possess lower thermal resistances than optimized plate-fin heat sinks when dimensionless pumping power is small and the dimensionless length of heat sinks is large. On the contrary, the optimized plate-fin heat sinks have smaller thermal resistances when dimensionless pumping power is large and the dimensionless length of heat sinks is small.
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content type line 23
ISSN:0017-9310
1879-2189
DOI:10.1016/j.ijheatmasstransfer.2009.02.041