Numerical study on flow and heat transfer of a hybrid microchannel cooling scheme using manifold arrangement and secondary channels

•A hybrid design using manifold arrangement and secondary channels for microchannel heat sink is proposed.•A Design Optimization Area (DOA) for the MMC-SOC is defined.•The pressure drop and thermal resistance can be both reduced in DOA.•The best hybrid design with geometrical parameters of (λ = 1, β...

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