Behavioral Thermal Modeling for Microwave Power Amplifier Design

System-level models simplify the analysis of complex RF systems, such as transmission-reception modules, by expressing global input-output relationships. However, the development of high RF power models for nonlinear subsystems requires the prediction of the distortion induced by low-frequency memor...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques Vol. 55; no. 11; pp. 2290 - 2297
Main Authors: Mazeau, J., Sommet, R., Caban-Chastas, D., Gatard, E., Quere, R., Mancuso, Y.
Format: Journal Article
Language:English
Published: New York, NY IEEE 01.11.2007
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN:0018-9480, 1557-9670
Online Access:Get full text
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Summary:System-level models simplify the analysis of complex RF systems, such as transmission-reception modules, by expressing global input-output relationships. However, the development of high RF power models for nonlinear subsystems requires the prediction of the distortion induced by low-frequency memory effects such as self-heating effects. In this framework, we present a new electrothermal behavioral model for power amplifiers. This global model is based on the coupling between a behavioral electrical model derived from the transistor-level description of the amplifier and a thermal reduced model. This model, implemented into a circuit simulator, allows to predict the impact of the thermal effects in pulsed RF mode thanks to an envelope transient analysis. This approach has also been validated by measurements.
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ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2007.907715