Behavioral Thermal Modeling for Microwave Power Amplifier Design
System-level models simplify the analysis of complex RF systems, such as transmission-reception modules, by expressing global input-output relationships. However, the development of high RF power models for nonlinear subsystems requires the prediction of the distortion induced by low-frequency memor...
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| Veröffentlicht in: | IEEE transactions on microwave theory and techniques Jg. 55; H. 11; S. 2290 - 2297 |
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| Hauptverfasser: | , , , , , |
| Format: | Journal Article |
| Sprache: | Englisch |
| Veröffentlicht: |
New York, NY
IEEE
01.11.2007
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Schlagworte: | |
| ISSN: | 0018-9480, 1557-9670 |
| Online-Zugang: | Volltext |
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| Zusammenfassung: | System-level models simplify the analysis of complex RF systems, such as transmission-reception modules, by expressing global input-output relationships. However, the development of high RF power models for nonlinear subsystems requires the prediction of the distortion induced by low-frequency memory effects such as self-heating effects. In this framework, we present a new electrothermal behavioral model for power amplifiers. This global model is based on the coupling between a behavioral electrical model derived from the transistor-level description of the amplifier and a thermal reduced model. This model, implemented into a circuit simulator, allows to predict the impact of the thermal effects in pulsed RF mode thanks to an envelope transient analysis. This approach has also been validated by measurements. |
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| Bibliographie: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 14 content type line 23 |
| ISSN: | 0018-9480 1557-9670 |
| DOI: | 10.1109/TMTT.2007.907715 |