Behavioral Thermal Modeling for Microwave Power Amplifier Design

System-level models simplify the analysis of complex RF systems, such as transmission-reception modules, by expressing global input-output relationships. However, the development of high RF power models for nonlinear subsystems requires the prediction of the distortion induced by low-frequency memor...

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Vydané v:IEEE transactions on microwave theory and techniques Ročník 55; číslo 11; s. 2290 - 2297
Hlavní autori: Mazeau, J., Sommet, R., Caban-Chastas, D., Gatard, E., Quere, R., Mancuso, Y.
Médium: Journal Article
Jazyk:English
Vydavateľské údaje: New York, NY IEEE 01.11.2007
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN:0018-9480, 1557-9670
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Popis
Shrnutí:System-level models simplify the analysis of complex RF systems, such as transmission-reception modules, by expressing global input-output relationships. However, the development of high RF power models for nonlinear subsystems requires the prediction of the distortion induced by low-frequency memory effects such as self-heating effects. In this framework, we present a new electrothermal behavioral model for power amplifiers. This global model is based on the coupling between a behavioral electrical model derived from the transistor-level description of the amplifier and a thermal reduced model. This model, implemented into a circuit simulator, allows to predict the impact of the thermal effects in pulsed RF mode thanks to an envelope transient analysis. This approach has also been validated by measurements.
Bibliografia:ObjectType-Article-2
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ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2007.907715