Rectilinear routing algorithm for crosstalk minimisation in 2D and 3D IC

The coupling capacitance and inductance of 2D and 3D integrated circuit (IC) interconnects in deep sub-micron technology has been increased due to reduced coupling distance in such a way that their magnitudes become comparable to the area and fringing capacitance of an interconnect. This leads to an...

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Bibliographic Details
Published in:	Chronic diseases and translational medicine Vol. 14; no. 6; pp. 263 - 271
Main Authors:	Mondal, Khokan, Das, Subhajit, Samanta, Tuhina
Format:	Journal Article
Language:	English
Published:	Beijing The Institution of Engineering and Technology 01.11.2020 John Wiley & Sons, Inc
Subjects:	2D IC 2D integrated circuit interconnects 3D IC 3D integrated circuit interconnects accurate noise assessment Algorithms circuit design Circuits coupled RLC on‐chip interconnects coupling capacitance coupling inductance crosstalk crosstalk minimisation crosstalk noise model deep sub‐micron technology Design fringing capacitance guarding TSV termination high‐frequency operation incorrect noise estimation integrated circuit design integrated circuit interconnections integrated circuit modelling integrated circuit noise Interconnect Linear programming network routing Noise control Number systems overestimation resources rectilinear routing algorithm reduced coupling distance Research Article RLC circuits SPICE substrate resistivity three‐dimensional integrated circuits through‐silicon‐via time‐efficient method TSV structure unintentional noise Wire crosstalk noise model 3D IC 2D IC coupling capacitance through-silicon-via reduced coupling distance coupling inductance 3D integrated circuit interconnects 2D integrated circuit interconnects rectilinear routing algorithm integrated circuit design crosstalk minimisation three-dimensional integrated circuits coupled RLC on-chip interconnects SPICE integrated circuit noise network routing unintentional noise RLC circuits incorrect noise estimation integrated circuit interconnections guarding TSV termination deep sub-micron technology high-frequency operation accurate noise assessment overestimation resources time-efficient method crosstalk integrated circuit modelling substrate resistivity fringing capacitance TSV structure circuit design
ISSN:	1751-8601, 1751-861X, 2095-882X, 1751-861X, 2589-0514
Online Access:	Get full text
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