2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high‐power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high‐performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat...

Celý popis

Uložené v:
Podrobná bibliografia
Vydané v:Advanced materials (Weinheim) Ročník 36; číslo 37; s. e2311335 - n/a
Hlavní autori: Dai, Wen, Wang, Yandong, Li, Maohua, Chen, Lu, Yan, Qingwei, Yu, Jinhong, Jiang, Nan, Lin, Cheng‐Te
Médium: Journal Article
Jazyk:English
Vydavateľské údaje: Germany Wiley Subscription Services, Inc 01.09.2024
Predmet:
2D materials
Boron nitride
Communications equipment
development history
Graphene
Heat
Heat sinks
Heat transfer
Structural design
Thermal conductivity
thermal interface materials
Two dimensional analysis
Two dimensional materials
development history
thermal interface materials
boron nitride
graphene
2D materials
ISSN:0935-9648, 1521-4095, 1521-4095
On-line prístup:Získať plný text
Tagy: Pridať tag
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
Popis
Shrnutí:The challenges associated with heat dissipation in high‐power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high‐performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal‐plane thermal conductivity and the capacity to facilitate cross‐scale, multi‐morphic structural design, have found widespread use as thermal fillers in the production of high‐performance TIMs. To deepen the understanding of 2D material‐based TIMs, this review focuses primarily on graphene and boron nitride‐based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials‐based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high‐performance TIMs. This review delves into high‐performance thermal interface materials (TIMs) based on 2D materials like graphene/boron nitride, pivotal for heat management in advanced electronics. Focusing on their structural attributes, properties, and applications, it differentiates from other reviews by emphasizing their developmental history, addressing critical challenges, and proposing solutions. Additionally, it introduces other 2D materials‐based TIMs, providing insights for future advancements.
Bibliografia:Dedicated to the 20th anniversary of the Ningbo Institute of Materials Technology and Engineering
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ObjectType-Review-3
content type line 23
ISSN:0935-9648
1521-4095
1521-4095
DOI:10.1002/adma.202311335