Molecular Dynamics Simulation Based Enhancement of Thermo-mechanical Properties of Basin Insulator Composite Epoxy Insulation Material

Given the critical role of epoxy resin's thermomechanical performance in the long-term safety of gas-insulated switchgear (GIS), this study focuses on enhancing epoxy resin properties through molecular dynamics modeling in Materials Studio. By considering real components, using bisphenol A-type...

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Vydáno v:Advances in Electrical and Computer Engineering Ročník 25; číslo 2; s. 3 - 10
Hlavní autoři: DUAN, Y., YANG, H., ZHAO, S., HUANG, J., ZHOU, F., GAO, C.
Médium: Journal Article
Jazyk:angličtina
Vydáno: Suceava Stefan cel Mare University of Suceava 01.06.2025
Témata:
Anhydrides
basin insulators
Bisphenol A
Composite materials
Crosslinking
Curing
Curing agents
Design and construction
Diaminodiphenylsulfone
Dynamic mechanical properties
epoxy resin
Epoxy resins
Fillers
Geographic information systems
Glass transition temperature
Heat conductivity
Insulation
Mechanical properties
Molecular chains
Molecular dynamics
Molecular simulation
Perl
Phenols
Physical properties
Switchgear
Thermal conductivity
Thermal properties
thermo-mechanical properties
Thermomechanical properties
Working conditions
China
ISSN:1582-7445, 1844-7600
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Shrnutí:Given the critical role of epoxy resin's thermomechanical performance in the long-term safety of gas-insulated switchgear (GIS), this study focuses on enhancing epoxy resin properties through molecular dynamics modeling in Materials Studio. By considering real components, using bisphenol A-type epoxy resin (DGEBA) as the matrix with 3,3'-diaminodiphenylsulfone (33DDS) or methyl-tetrahydrophthalic anhydride (MeTHPA) curing agents, Al2O3 filler, and phenol (Ph) accelerator, several molecular dynamics models with different components were established. Crosslinking analyses in 0% to 93% were performed via Perl scripts, with thermomechanical properties analyzed across different components and crosslinking degrees in the 250-600 K temperature range. The results indicate that Al2O3 fillers effectively raise the glass transition temperature of epoxy resins while significantly enhancing their thermal conductivity. Higher crosslinking degrees enhance overall mechanical properties, while formulas with fillers and anhydride curing agents show improved specific mechanical indices. Additionally, increased crosslinking degrees elevate molecular chain segment mobility, and filler addition reduces mean square displacement curve slopes. This work provides a theoretical base for optimizing epoxy insulation reliability in GIS applications. Index Terms--epoxy resin, basin insulators, thermomechanical properties, thermal conductivity, molecular dynamics.
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ISSN:1582-7445
1844-7600
DOI:10.4316/AECE.2025.02001