IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

In the context of high-performance computing, the integration of more computing capabilities with generic cores or dedicated accelerators for artificial intelligence (AI) application is raising more and more challenges. Due to the increasing costs of advanced nodes and the difficulties of shrinking...

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Veröffentlicht in:	IEEE journal of solid-state circuits Jg. 56; H. 1; S. 79 - 97
Hauptverfasser:	Vivet, Pascal, Guthmuller, Eric, Thonnart, Yvain, Pillonnet, Gael, Fuguet, Cesar, Miro-Panades, Ivan, Moritz, Guillaume, Durupt, Jean, Bernard, Christian, Varreau, Didier, Pontes, Julian, Thuries, Sebastien, Coriat, David, Harrand, Michel, Dutoit, Denis, Lattard, Didier, Arnaud, Lucile, Charbonnier, Jean, Coudrain, Perceval, Garnier, Arnaud, Berger, Frederic, Gueugnot, Alain, Greiner, Alain, Meunier, Quentin L., Farcy, Alexis, Arriordaz, Alexandre, Cheramy, Severine, Clermidy, Fabien
Format:	Journal Article
Sprache:	Englisch
Veröffentlicht:	New York IEEE 01.01.2021 The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Institute of Electrical and Electronics Engineers
Schlagworte:	3D technology Accelerators active interposer Analog circuits Artificial intelligence Bridge circuits chiplet Circuit design CMOS CMOS technology Communications systems Computation Computer architecture Computer networks Converters Distributed memory Electric power distribution Energy conversion efficiency Engineering Sciences Input output Integrated circuit interconnections Interconnections Memory management Micro and nanotechnologies Microelectronics Microprocessors Network latency network-on-chip (NoC) Power management Power system management Substrates thermal dissipation Three-dimensional displays
ISSN:	0018-9200, 1558-173X
Online-Zugang:	Volltext
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