Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W

[Display omitted] •A kinetic model explains and predicts residual stress evolution during deposition of sputtered and evaporated metallic thin films.•The model includes stress generation from deposition processes, grain growth and energetic particle bombardment.•The model is used to analyze six meta...

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Bibliographic Details

Published in:	Applied surface science Vol. 613; p. 156000
Main Authors:	Su, Tong, Rao, Zhaoxia, Berman, Sarah, Depla, Diederik, Chason, Eric
Format:	Journal Article
Language:	English
Published:	Elsevier B.V 15.03.2023
Subjects:	Kinetic model Polycrystalline thin films Residual stress Sputtering deposition Polycrystalline thin films Kinetic model Sputtering deposition Residual stress
ISSN:	0169-4332
Online Access:	Get full text
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