Detection and clustering of mixed-type defect patterns in wafer bin maps

In semiconductor manufacturing, a wafer bin map (WBM) is a map that consists of assigned bin values for dies based on wafer test results (e.g., value 1 for good dies and value 0 for defective dies). The bin values of adjacent dies are often spatially correlated, forming some systematic defect patter...

Celý popis

Podrobná bibliografia

Vydané v:	IISE transactions Ročník 50; číslo 2; s. 99 - 111
Hlavní autori:	Kim, Jinho, Lee, Youngmin, Kim, Heeyoung
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	Taylor & Francis 01.02.2018
Predmet:	Dirichlet process Gaussian process latent variable model infinite warped mixture model semiconductor manufacturing
ISSN:	2472-5854, 2472-5862
On-line prístup:	Získať plný text
Tagy:	Pridať tag Žiadne tagy, Buďte prvý, kto otaguje tento záznam!