Detection and clustering of mixed-type defect patterns in wafer bin maps

In semiconductor manufacturing, a wafer bin map (WBM) is a map that consists of assigned bin values for dies based on wafer test results (e.g., value 1 for good dies and value 0 for defective dies). The bin values of adjacent dies are often spatially correlated, forming some systematic defect patter...

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Bibliographic Details

Published in:	IISE transactions Vol. 50; no. 2; pp. 99 - 111
Main Authors:	Kim, Jinho, Lee, Youngmin, Kim, Heeyoung
Format:	Journal Article
Language:	English
Published:	Taylor & Francis 01.02.2018
Subjects:	Dirichlet process Gaussian process latent variable model infinite warped mixture model semiconductor manufacturing
ISSN:	2472-5854, 2472-5862
Online Access:	Get full text
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