Review of research progress and development trend of digital image correlation

PurposeThe purpose of this paper is to provide a comprehensive review of a non-contact full-field optical measurement technique known as digital image correlation (DIC).Design/methodology/approachThe approach of this review paper is to introduce the research pertaining to DIC. It comprehensively cov...

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Bibliographic Details
Published in:Multidiscipline modeling in materials and structures Vol. 20; no. 1; pp. 81 - 114
Main Authors: He, Xindang, Zhou, Run, Liu, Zheyuan, Yang, Suliang, Chen, Ke, Li, Lei
Format: Journal Article
Language:English
Published: Bingley Emerald Publishing Limited 29.01.2024
Emerald Group Publishing Limited
Subjects:
Algorithms
Composite materials
Deformation
Digital imaging
High temperature
Image registration
Load
Measurement techniques
Mechanical properties
Optical measurement
Reviews
Shear strain
Speckle interferometry
Strain gauges
Stress measurement
Trends
Ultrahigh temperature
Speckle
Camera calibration
Deformation measurement technology
Digital image correlation
Ultra-high temperature environment
Search algorithm
ISSN:1573-6105, 1573-6113
Online Access:Get full text
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Summary:PurposeThe purpose of this paper is to provide a comprehensive review of a non-contact full-field optical measurement technique known as digital image correlation (DIC).Design/methodology/approachThe approach of this review paper is to introduce the research pertaining to DIC. It comprehensively covers crucial facets including its principles, historical development, core challenges, current research status and practical applications. Additionally, it delves into unresolved issues and outlines future research objectives.FindingsThe findings of this review encompass essential aspects of DIC, including core issues like the subpixel registration algorithm, camera calibration, measurement of surface deformation in 3D complex structures and applications in ultra-high-temperature settings. Additionally, the review presents the prevailing strategies for addressing these challenges, the most recent advancements in DIC applications across quasi-static, dynamic, ultra-high-temperature, large-scale and micro-scale engineering domains, along with key directions for future research endeavors.Originality/valueThis review holds a substantial value as it furnishes a comprehensive and in-depth introduction to DIC, while also spotlighting its prospective applications.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
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ISSN:1573-6105
1573-6113
DOI:10.1108/MMMS-07-2023-0242