Circuit realization of topological physics

Recently, topolectrical circuits (TECs) boom in studying the topological states of matter. The resemblance between circuit Laplacians and tight-binding models in condensed matter physics allows for the exploration of exotic topological phases on the circuit platform. In this review, we begin by pres...

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Bibliographic Details
Published in:Physics reports Vol. 1093; pp. 1 - 54
Main Authors: Yang, Huanhuan, Song, Lingling, Cao, Yunshan, Yan, Peng
Format: Journal Article
Language:English
Published: Elsevier B.V 21.11.2024
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ISSN:0370-1573
Online Access:Get full text
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Summary:Recently, topolectrical circuits (TECs) boom in studying the topological states of matter. The resemblance between circuit Laplacians and tight-binding models in condensed matter physics allows for the exploration of exotic topological phases on the circuit platform. In this review, we begin by presenting the basic equations for the circuit elements and units, along with the fundamentals and experimental methods for TECs. Subsequently, we retrospect the main literature in this field, encompassing the circuit realization of (higher-order) topological insulators and semimetals. Due to the abundant electrical elements and flexible connections, many unconventional topological states like the non-Hermitian, nonlinear, non-Abelian, non-periodic, non-Euclidean, and higher-dimensional topological states that are challenging to observe in conventional condensed matter physics, have been observed in circuits and summarized in this review. Furthermore, we show the capability of electrical circuits for exploring the physical phenomena in other systems, such as photonic and magnetic ones. Importantly, we highlight TEC systems are convenient for manufacture and miniaturization because of their compatibility with the traditional integrated circuits. Finally, we prospect the future directions in this exciting field, and connect the emerging TECs with the development of topology physics, (meta)material designs, and device applications.
ISSN:0370-1573
DOI:10.1016/j.physrep.2024.09.007