Liquid metal microfluidic cooling system for high-efficiency thermal management via learning-based genetic algorithm

High heat flux density is a critical factor that limits the performance and reliability of miniaturized, high-power microelectronic systems. This study proposes a liquid metal (LM)-based microfluidic cooling system optimized through a data-driven computational framework based on an enhanced Genetic...

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Bibliographic Details
Published in:Engineering applications of artificial intelligence Vol. 161; p. 112324
Main Authors: Wang, Yucheng, Bi, Antong, Chen, Kaiyu, Yu, Shenxin, Gao, Wanping, Zhang, Wenyi, Wu, Yuwan, Li, Zhiqiang, Wang, Shaoxi
Format: Journal Article
Language:English
Published: Elsevier Ltd 12.12.2025
Subjects:
Algorithm-guided parameter tuning
Enhanced genetic algorithm
Liquid metal
Microfludic cooling
Thermal management
Thermal management
Liquid metal
Microfludic cooling
Enhanced genetic algorithm
Algorithm-guided parameter tuning
ISSN:0952-1976
Online Access:Get full text
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Summary:High heat flux density is a critical factor that limits the performance and reliability of miniaturized, high-power microelectronic systems. This study proposes a liquid metal (LM)-based microfluidic cooling system optimized through a data-driven computational framework based on an enhanced Genetic Algorithm (LC-GA), aiming to deliver an efficient thermal management solution for high-density integrated systems. By integrating LM near-junction cooling with microchannel heat dissipation in a silicon substrate, we developed a heterogeneous three-dimensional interconnect cooling architecture capable of optimizing thermal performance through algorithm-guided parameter tuning. To validate the proposed method, four distinct microchannel configurations were designed, fabricated, and experimentally tested. LM was introduced into the channels to conduct both experimental cooling tests and thermal performance simulations on a simulated heat source. The results demonstrate that this LM-based microfluidic cooling system, optimized through computational parameter determination, can effectively dissipate heat from chips with power consumption up to 800 W while maintaining stable thermal performance. Additionally, a response surface methodology combined with enhanced LC-GA was utilized for multi-factor sensitivity analysis and multi-objective optimization, enabling automatic determination of optimal design and operating parameters to balance thermal resistance and pressure drop. The optimized configuration reduced the maximum chip temperature to approximately 357.54 K, lowered the system pressure requirement, and improved the Performance Evaluation Criterion (PEC) to 2.327. This work provides a data-driven optimization approach that supports the development of high-performance integrated microsystems through algorithm-assisted thermal design.
ISSN:0952-1976
DOI:10.1016/j.engappai.2025.112324