Development of STEAM activity on nanotechnology to determine basic science process skills and engineering design process for high school students

[Display omitted] •This study aimed to develop a STEAM activity on nanotechnology for students in high school level.•The basic science process skills and the engineering design process were essential elements of STEAM education.•STEAM activity could attract attention of the students and encourage th...

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Veröffentlicht in:Thinking skills and creativity Jg. 39; S. 100796
Hauptverfasser: Khamhaengpol, Arunrat, Sriprom, Malee, Chuamchaitrakool, Porntip
Format: Journal Article
Sprache:Englisch
Veröffentlicht: Elsevier Ltd 01.03.2021
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ISSN:1871-1871, 1878-0423
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Zusammenfassung:[Display omitted] •This study aimed to develop a STEAM activity on nanotechnology for students in high school level.•The basic science process skills and the engineering design process were essential elements of STEAM education.•STEAM activity could attract attention of the students and encourage the students’ creativity.•STEAM activity encouraged engineering design process of the students at moderate level of basic science process skills. Nanotechnology and materials science participated in several fields of uses. Science behind nanotechnology was an integration of disciplines and creativity. This study aimed to develop a STEAM activity on nanotechnology for students in high school level. The sample of this study consisted of 46 groups of students from four schools in Sakon Nakhon province, Thailand. The achievements of the students on the basic science process skills (BSPS) and the engineering design process (EDP) were assessed after conducting the STEAM approach. The results of the study showed that the proposed STEAM activity encouraged the EDP of the students, especially those whose BSPS were in the moderate level. While the achievement result of the students on the BSPS was in the good level. A guidance for the instructor to further promote the skills of the students was suggested.
ISSN:1871-1871
1878-0423
DOI:10.1016/j.tsc.2021.100796