A systolic architecture for modulo multiplication

With the current advances in VLSI technology, traditional algorithms for Residue Number System (RNS) based architectures should be reevaluated to explore the new technology dimensions. In this brief, we introduce A /spl theta/(log n) algorithm for large moduli multiplication for RNS based architectu...

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Bibliographic Details
Published in:IEEE transactions on circuits and systems. 2, Analog and digital signal processing Vol. 42; no. 11; pp. 725 - 729
Main Authors: Elleithy, K.M., Bayoumi, M.A.
Format: Journal Article
Language:English
Published: New York, NY IEEE 01.11.1995
Institute of Electrical and Electronics Engineers
Subjects:
Acceleration
Adders
Algorithm design and analysis
Applied sciences
CMOS technology
Digital arithmetic
Electronics
Exact sciences and technology
Integrated circuits
Integrated circuits by function (including memories and processors)
Minerals
Petroleum
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Systolic arrays
Throughput
Very large scale integration
Arithmetic circuit
VLSI circuit
Circuit design
Complementary MOS technology
Multiplier
Adder
Systolic network
Implementation
ISSN:1057-7130
Online Access:Get full text
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Summary:With the current advances in VLSI technology, traditional algorithms for Residue Number System (RNS) based architectures should be reevaluated to explore the new technology dimensions. In this brief, we introduce A /spl theta/(log n) algorithm for large moduli multiplication for RNS based architectures. A systolic array has been designed to perform the modulo multiplication algorithm. The proposed modulo multiplier is much faster than previously proposed multipliers and more area efficient. The implementation of this multiplier is modular and is based on using simple cells which leads to efficient VLSI realization. A VLSI implementation using 3 micron CMOS technology shows that a pipelined n-bit module multiplication scheme can operate with a throughput of 30 M operation per second.< >
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ISSN:1057-7130
DOI:10.1109/82.475251