Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC
Saved in:
| Published in: | IEEE transactions on electromagnetic compatibility Vol. 65; no. 6; pp. 2070 - 2071 |
|---|---|
| Format: | Journal Article |
| Language: | English |
| Published: |
IEEE
01.12.2023
|
| ISSN: | 0018-9375, 1558-187X |
| Online Access: | Get full text |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| BookMark | eNpNkN9KwzAUxoNMcJs-gOBFHmCdSU6yprsrdepgQ8FdeFfS9EQjNS2NCr693Rzi1eH8-T6-85uQUWgDEnLJ2Zxzll3vVttiLpiAOQAIruGEjLlSOuE6fR6RMWNcJxmk6oxMYnwbWqkEjElTmKahru3po-mwj0v61KH1pqHrGD-RtoHm6xndGvvqA9INmj748DKjJtT0BrH7Gy1pXn-ZYDEednnXNd6aD9-GePAfAp6TU2eaiBfHOiW729WuuE82D3frIt8klrMFJFBpZiFFJuWCLSQ6rjQqMeStsdLScsccVrKG4T_JbGpRVpmwpq4zl3KEKeG_trZvY-zRlV3v303_XXJW7mmVe1rlnlZ5pDVorn41HhH_3YPKpNDwA59FZvE |
|---|---|
| CODEN | IEMCAE |
| ContentType | Journal Article |
| DBID | 97E RIA RIE AAYXX CITATION |
| DOI | 10.1109/TEMC.2023.3332183 |
| DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005–Present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library (IEL) CrossRef |
| DatabaseTitle | CrossRef |
| Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://ieeexplore.ieee.org/ sourceTypes: Publisher |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISSN | 1558-187X |
| EndPage | 2071 |
| ExternalDocumentID | 10_1109_TEMC_2023_3332183 10359428 |
| Genre | call-for-papers |
| GroupedDBID | -~X .DC 0R~ 29I 4.4 5GY 5VS 6IK 97E AAJGR AARMG AASAJ AAWTH ABAZT ABFSI ABQJQ ABVLG ACGFO ACIWK ACNCT AENEX AETIX AGQYO AGSQL AHBIQ AI. AIBXA AKJIK AKQYR ALLEH ALMA_UNASSIGNED_HOLDINGS ASUFR ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 E.L EBS EJD HZ~ H~9 IAAWW IBMZZ ICLAB IDIHD IFIPE IFJZH IPLJI JAVBF LAI M43 MS~ O9- OCL P2P RIA RIE RNS RXW TAE TAF TN5 VH1 AAYXX CITATION |
| ID | FETCH-LOGICAL-c1063-3b80c37e0446064ef158e52523deb84c1f0feb4d355840c7ce4b92cadd9f71e3 |
| IEDL.DBID | RIE |
| ISSN | 0018-9375 |
| IngestDate | Sat Nov 29 02:05:42 EST 2025 Wed Aug 27 02:24:43 EDT 2025 |
| IsDoiOpenAccess | false |
| IsOpenAccess | true |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 6 |
| Language | English |
| License | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html https://doi.org/10.15223/policy-009 https://doi.org/10.15223/policy-001 |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c1063-3b80c37e0446064ef158e52523deb84c1f0feb4d355840c7ce4b92cadd9f71e3 |
| OpenAccessLink | https://ieeexplore.ieee.org/ielx7/15/10359423/10359428.pdf |
| PageCount | 2 |
| ParticipantIDs | ieee_primary_10359428 crossref_primary_10_1109_TEMC_2023_3332183 |
| PublicationCentury | 2000 |
| PublicationDate | 2023-Dec. 2023-12-00 |
| PublicationDateYYYYMMDD | 2023-12-01 |
| PublicationDate_xml | – month: 12 year: 2023 text: 2023-Dec. |
| PublicationDecade | 2020 |
| PublicationTitle | IEEE transactions on electromagnetic compatibility |
| PublicationTitleAbbrev | TEMC |
| PublicationYear | 2023 |
| Publisher | IEEE |
| Publisher_xml | – name: IEEE |
| SSID | ssj0014523 |
| Score | 2.3125865 |
| SourceID | crossref ieee |
| SourceType | Index Database Publisher |
| StartPage | 2070 |
| Title | Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC |
| URI | https://ieeexplore.ieee.org/document/10359428 |
| Volume | 65 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| journalDatabaseRights | – providerCode: PRVIEE databaseName: IEEE Electronic Library (IEL) customDbUrl: eissn: 1558-187X dateEnd: 99991231 omitProxy: false ssIdentifier: ssj0014523 issn: 0018-9375 databaseCode: RIE dateStart: 19640101 isFulltext: true titleUrlDefault: https://ieeexplore.ieee.org/ providerName: IEEE |
| link | http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV07T8MwELZoxQADzyLKSx6YUFMcO6njblFpBRKtOnToFvlxQUhVWvXB78d2QhUGBrbIeSi5i-Pv8t19h9Ajl8arsgfMcAiiREIgpGKBAkmEUjaWy72I6zufTJL5XEyrYnVfCwMAPvkMum7Tc_lmqXfuV5md4SwWFi83UIPzXlmstacMopiWdHJoZzDjcUVhhkQ8z4bjQdf1Ce8yxhwm-LUI1bqq-EVldPrP2zlDJxV6xGnp7nN0AMUFOq5pCl6ixUAuFthCUTyVK4vt-rhqMY99oz28LHD61sFjn0QJuNJX_ehgWRj8ArDaD_VxWiYIbPy-tEZ1--vbx22h2Wg4G7wGVUuFQNvYjwVMJUQzDo7GtWAE8jBOIKbWdAZUEukwJzmoyDjR9YhoriFSgmr7ERQ5D4FdoWaxLOAaYapUznoxldRpBiqjZKIMVSI2lBKVkzZ6-jFxtiqFMzIfcBCROX9kzh9Z5Y82ajnz1g4sLXvzx_gtOnKnl2kld6i5Xe_gHh3qr-3nZv3g34tvhVW1KA |
| linkProvider | IEEE |
| linkToHtml | http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV07T8MwELagIAEDzyLK0wMTIsWxHRJ3i0qrVrRVhw7dIju-IKQqrfrg92M7oQoDA1vkRFZyF8ff5bv7DqHHUGqnyu4xHYLHIwmekIp5CiQRSplYLnMiroNwNIqmUzEui9VdLQwAuOQzaNpDx-Xrebqxv8rMCmeBMHh5F-0FnFNSlGttSQMe0IJQ9s0aZmFQkpg-ES-TzrDdtJ3Cm4wxiwp-bUOVvipuW-me_POGTtFxiR9xXDj8DO1Afo6OKqqCF2jWlrMZNmAUj-XCoLsWLpvMY9dqD89zHPef8dClUQIuFVY_nrHMNX4DWGyHWjguUgRW7lxcIbvd_OZx62jS7UzaPa9squClJvpjHlMRSVkIlsg1cAQyP4ggoMZ0GlTEUz8jGSiurew6J2mYAleCpuYzKLLQB3aJavk8hyuEqVIZew2opFY1UGklI6WpEoGmlKiMNNDTj4mTRSGdkbiQg4jE-iOx_khKfzRQ3Zq3cmFh2es_xh_QQW8yHCSD_uj9Bh3aqYokk1tUWy83cIf206_152p5796RbyLLuG8 |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Call+for+Papers%3A+Special+Issue+on+AI%2C+Machine+Learning%2C+and+Deep+Learning%3A+Advances+and+Applications+for+EMC&rft.jtitle=IEEE+transactions+on+electromagnetic+compatibility&rft.date=2023-12-01&rft.pub=IEEE&rft.issn=0018-9375&rft.volume=65&rft.issue=6&rft.spage=2070&rft.epage=2071&rft_id=info:doi/10.1109%2FTEMC.2023.3332183&rft.externalDocID=10359428 |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0018-9375&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0018-9375&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0018-9375&client=summon |