55‐1: Invited Paper: Yield and manufacturing challenges for microLED micro‐displays

In this paper, we discuss microLED display yield and manufacturing challenges related to the CMOS integration as well as epi‐defectivity. Based on those considerations, we show the MICLEDI approach how to address them in a 300mm foundry compatible integration flow.

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Vydáno v:SID International Symposium Digest of technical papers Ročník 55; číslo S1; s. 481 - 483
Hlavní autoři: Steudel, Soeren, Vertommen, Johan, Bach, Lars
Médium: Journal Article
Jazyk:angličtina
Vydáno: Campbell Wiley Subscription Services, Inc 01.04.2024
Témata:
AR display
Light emitting diodes
Manufacturing
microdisplay
microLED
ISSN:0097-966X, 2168-0159
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Shrnutí:In this paper, we discuss microLED display yield and manufacturing challenges related to the CMOS integration as well as epi‐defectivity. Based on those considerations, we show the MICLEDI approach how to address them in a 300mm foundry compatible integration flow.
Bibliografie:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.17117