55‐1: Invited Paper: Yield and manufacturing challenges for microLED micro‐displays

In this paper, we discuss microLED display yield and manufacturing challenges related to the CMOS integration as well as epi‐defectivity. Based on those considerations, we show the MICLEDI approach how to address them in a 300mm foundry compatible integration flow.

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Veröffentlicht in:SID International Symposium Digest of technical papers Jg. 55; H. S1; S. 481 - 483
Hauptverfasser: Steudel, Soeren, Vertommen, Johan, Bach, Lars
Format: Journal Article
Sprache:Englisch
Veröffentlicht: Campbell Wiley Subscription Services, Inc 01.04.2024
Schlagworte:
AR display
Light emitting diodes
Manufacturing
microdisplay
microLED
ISSN:0097-966X, 2168-0159
Online-Zugang:Volltext
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Zusammenfassung:In this paper, we discuss microLED display yield and manufacturing challenges related to the CMOS integration as well as epi‐defectivity. Based on those considerations, we show the MICLEDI approach how to address them in a 300mm foundry compatible integration flow.
Bibliographie:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.17117