55‐1: Invited Paper: Yield and manufacturing challenges for microLED micro‐displays

In this paper, we discuss microLED display yield and manufacturing challenges related to the CMOS integration as well as epi‐defectivity. Based on those considerations, we show the MICLEDI approach how to address them in a 300mm foundry compatible integration flow.

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Vydané v:SID International Symposium Digest of technical papers Ročník 55; číslo S1; s. 481 - 483
Hlavní autori: Steudel, Soeren, Vertommen, Johan, Bach, Lars
Médium: Journal Article
Jazyk:English
Vydavateľské údaje: Campbell Wiley Subscription Services, Inc 01.04.2024
Predmet:
AR display
Light emitting diodes
Manufacturing
microdisplay
microLED
ISSN:0097-966X, 2168-0159
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Abstract In this paper, we discuss microLED display yield and manufacturing challenges related to the CMOS integration as well as epi‐defectivity. Based on those considerations, we show the MICLEDI approach how to address them in a 300mm foundry compatible integration flow.
AbstractList In this paper, we discuss microLED display yield and manufacturing challenges related to the CMOS integration as well as epi‐defectivity. Based on those considerations, we show the MICLEDI approach how to address them in a 300mm foundry compatible integration flow.
Author Vertommen, Johan
Steudel, Soeren
Bach, Lars
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SubjectTerms AR display
Light emitting diodes
Manufacturing
microdisplay
microLED
Title 55‐1: Invited Paper: Yield and manufacturing challenges for microLED micro‐displays
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