NeurFill: Migrating Full-Chip CMP Simulators to Neural Networks for Model-Based Dummy Filling Synthesis

Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper proposes a novel model-based dummy filling synthesis framework NeurFill, integrated with multiple starting points-seque...

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Veröffentlicht in:	2021 58th ACM/IEEE Design Automation Conference (DAC) S. 187 - 192
Hauptverfasser:	Cai, Junzhe, Yan, Changhao, Ma, Yuzhe, Yu, Bei, Zhou, Dian, Zeng, Xuan
Format:	Tagungsbericht
Sprache:	Englisch
Veröffentlicht:	IEEE 05.12.2021
Schlagworte:	Backpropagation Design automation Filling Manufacturing Neural networks Semiconductor device modeling Very large scale integration
Online-Zugang:	Volltext
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