Steady-state dynamic temperature analysis and reliability optimization for embedded multiprocessor systems

In this paper we propose an analytical technique for the steady-state dynamic temperature analysis (SSDTA) of multiprocessor systems with periodic applications. The approach is accurate and, moreover, fast, such that it can be included inside an optimization loop for embedded system design. Using th...

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Vydané v:DAC Design Automation Conference 2012 s. 197 - 204
Hlavní autori: Ukhov, Ivan, Bao, Min, Eles, Petru, Peng, Zebo
Médium: Konferenčný príspevok..
Jazyk:English
Vydavateľské údaje: New York, NY, USA ACM 03.06.2012
IEEE
Edícia:ACM Conferences
Predmet:
Applied computing > Arts and humanities > Architecture (buildings) > Computer-aided design
Applied computing > Physical sciences and engineering > Engineering > Computer-aided design
Approximation methods
Computer systems organization > Embedded and cyber-physical systems
Computer systems organization > Real-time systems
Computing methodologies > Symbolic and algebraic manipulation > Symbolic and algebraic algorithms > Linear algebra algorithms
Equations
Leakage Power
Mathematical model
Mathematics of computing > Mathematical analysis > Numerical analysis > Computations on matrices
Mathematics of computing > Probability and statistics > Statistical paradigms > Survival analysis
Multiprocessor System
Optimization
Periodic Power Profile
Reliability
Steady-state
Symmetric matrices
TECHNOLOGY
TEKNIKVETENSKAP
Temperature Analysis
Thermal Cycling Fatigue
periodic power profile
thermal cycling fatigue
leakage power
temperature analysis
multiprocessor system
Periodic Power Profile
Leakage Power
Thermal Cycling Fatigue
Temperature Analysis
Multiprocessor System
ISBN:1450311997, 9781450311991
ISSN:0738-100X
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Popis
Shrnutí:In this paper we propose an analytical technique for the steady-state dynamic temperature analysis (SSDTA) of multiprocessor systems with periodic applications. The approach is accurate and, moreover, fast, such that it can be included inside an optimization loop for embedded system design. Using the proposed solution, a temperature-aware reliability optimization, based on the thermal cycling failure mechanism, is presented. The experimental results confirm the quality and speed of our SSDTA technique, compared to the state of the art. They also show that the lifetime of an embedded system can significantly be improved, without sacrificing its energy efficiency, by taking into consideration, during the design stage, the steady-state dynamic temperature profile of the system.
ISBN:1450311997
9781450311991
ISSN:0738-100X
DOI:10.1145/2228360.2228399