GIA: A Reusable General Interposer Architecture for Agile Chiplet Integration

2.5D chiplet technology is gaining popularity for the efficiency of integrating multiple heterogeneous dies or chiplets on interposers, and it is also considered an ideal option for agile silicon system design by mitigating the huge design, verification, and manufacturing overhead of monolithic SoCs....

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Vydané v:	2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD) s. 1 - 9
Hlavní autori:	Li, Fuping, Wang, Ying, Cheng, Yuanqing, Wang, Yujie, Han, Yinhe, Li, Huawei, Li, Xiaowei
Médium:	Konferenčný príspevok..
Jazyk:	English
Vydavateľské údaje:	ACM 29.10.2022
Predmet:	2.5D integration chiplet interposer network-on-chip reusability
ISSN:	1558-2434
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