2022 ICCAD CAD Contest Problem B: 3D Placement with D2D Vertical Connections

In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small dies. By having the multiple small dies with die-to-die (D2D) vertical connections, the benefits including: 1) better yield, 2) better timing/performance, and 3) better cost. Ho...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD) S. 1 - 5
Hauptverfasser: Hu, Kai-Shun, Lin, I-Jye, Huang, Yu-Hui, Chi, Hao-Yu, Wu, Yi-Hsuan, Shen, Chin-Fang Cindy
Format: Tagungsbericht
Sprache:Englisch
Veröffentlicht: ACM 29.10.2022
Schlagworte:
3DIC
Benchmark testing
Computer architecture
Costs
Design automation
Measurement
Microprocessors
Physical design
placement
Three-dimensional displays
ISSN:1558-2434
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small dies. By having the multiple small dies with die-to-die (D2D) vertical connections, the benefits including: 1) better yield, 2) better timing/performance, and 3) better cost. How to do the netlist partitioning, cell placement in each of the small dies, and also how to determine the location of the D2D inter-connection terminals becomes a new topic.To address this chiplet era physical implementation problem, ICCAD-2022 contest encourages the research in the techniques of multi-die netlist partitioning and placement with D2D vertical connections. We provided (i) a set of benchmarks and (ii) an evaluation metric that facilitate contestants to develop, test, and evaluate their new algorithms.
ISSN:1558-2434
DOI:10.1145/3508352.3561108