Accelerating design-technology co-development using neural compact modeling and data-driven SPICE simulation

This paper proposes a new design-technology cooptimization framework that expedites circuit optimization by utilizing the neural compact modeling (NCM) and a data-driven SPICE simulation. An efficient retargeting strategy of NCM and its improved design capability through a direct data driven SPICE s...

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Veröffentlicht in:	2025 62nd ACM/IEEE Design Automation Conference (DAC) S. 1 - 6
Hauptverfasser:	Lee, Yongjeong, Lee, Seungsoo, Kim, Jeongyeol, Choi, Jungyun, Li, Zhaojie, Wu, Dehuang, Wang, Joddy
Format:	Tagungsbericht
Sprache:	Englisch
Veröffentlicht:	IEEE 22.06.2025
Schlagworte:	Data-driven SPICE model Design-technology co-optimization Integrated circuit modeling Interpolation Mathematical models Neural compact model Optimization Predictive models Robustness Semiconductor device measurement SPICE Transfer learning Transistors
Online-Zugang:	Volltext
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