ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation

A review of recent studies on up-to-date IC shows that electromigration (EM) has become one of the major challenges for 2.5D and 3D chiplet heterogeneous integration (CHI) systems. However, most existing researches on EM are focusing on 2D power delivery network without taking Through Silicon Via (T...

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Vydáno v:	2025 62nd ACM/IEEE Design Automation Conference (DAC) s. 1 - 7
Hlavní autoři:	Sun, Zeyu, Tong, Weijie, Ma, Xiaoning, Cao, He, Liu, Jianyun, Li, Zhiqiang, Xu, Qinzhi
Médium:	Konferenční příspěvek
Jazyk:	angličtina
Vydáno:	IEEE 22.06.2025
Témata:	Chiplet integration systems Chiplets Electromigration Finite difference methods Finite element analysis Reliability Stress Thermal resistance Thermal stresses Thermal-electrical co-simulation Three-dimensional displays Through-silicon vias Time-domain analysis TSV
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