Clearance-Constrained PCB Global Placement with Heterogeneous Components

The complexity of design rules and intense time-to-market demands have made auto-placement tools essential for advanced printed circuit board (PCB) designs. This paper presents a novel PCB placement framework to handle pad-to-pad clearance constraints and heterogeneous components to address these ch...

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Veröffentlicht in:2025 62nd ACM/IEEE Design Automation Conference (DAC) S. 1 - 7
Hauptverfasser: Chen, Yan-Jen, Huang, Wei-Kai, Tsai, Chung-Ting, Ou, Chiao-Yu, Chang, Yao-Wen
Format: Tagungsbericht
Sprache:Englisch
Veröffentlicht: IEEE 22.06.2025
Schlagworte:
Benchmark testing
Complexity theory
Design automation
Integrated circuit modeling
Printed circuits
Routing
Shape
Signal resolution
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Zusammenfassung:The complexity of design rules and intense time-to-market demands have made auto-placement tools essential for advanced printed circuit board (PCB) designs. This paper presents a novel PCB placement framework to handle pad-to-pad clearance constraints and heterogeneous components to address these challenges. Unlike existing academic placers, our framework focuses on the following key features: a wire-area model to account for various routing resource needs between power and signal nets, a pad-to-pad clearance model to minimize spacing violations, and a two-sided, pad-type-aware density model to reduce component and pad overlap. We further develop a quadratic programming-based legalizer to resolve constraint violations among components of varying shapes. Experimental results show the effectiveness and efficiency of our framework, surpassing two state-of-theart academic placers in post-routing quality on both academic and industrial benchmarks.
DOI:10.1109/DAC63849.2025.11133056