Wafer scale integration. Vol. III : Proceedings of the 3rd IFIP WG 10.5 workshop, Como, Italy, 6 - 8 June 1989 /

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Bibliographic Details
Main Author: Treleaven, Philip
Corporate Author: Proceedings of the 3rd IFIP WG 10.5 workshop Italy, Como
Other Authors: Sami, M. (Editor), Distante, F.
Format: Conference Proceeding Book
Language:English
Published: Amsterdam : North-Holland Publishing, 1990
Edition:[1st ed.]
Subjects:
ISBN:0444884963
Online Access: Get full text
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